PRINTED CIRCUIT BOARD DESIGN AND
Ultra Fine Pitch
Class 3 / J-STD
For over 30 years QC Graphics has been supplying top of the line services to
the Printed Circuit Board industry. We are staffed with experienced PCB
Design and Assembly people ready to support the Engineer.
QCG, Inc. - Printed Circuit Board experts in hard to build technology such as Package on
Package (PoP BGA), Dual row QFN / Multi row QFN and fine pitch bump die; all with
competitive rates to keep your purchasing manager happy.
QCG is an AS9100C - ISO 9001:2008 certified PCB design and electronics manufacturing
company. Our staff of IPC-610 and J-STD-001E certified technicians have the surgical
precision you need for high yield prototype through production.
Reduce your schedule, increase your yields, and protect your budget.
Your PCB R&D is welcome here, this is where we shine. Bring us your
quick-turn prototype, BGA Reball, PCB rework and repair. We have the right
equipment and the expertise for your engineering projects and a successful first
Your Prototype - supported by AOI, Xray and Ersascope
... geared towards the engineer.
• Package on Package PoP BGA
• Dual Row QFN
• Multi-Row QFN
Experts in hard to build technology:
Work with our experienced in-house PCB Design team to eliminate the
unnecessary board revisions that typically happen when ramping up to production
volume. QCG Designers have the experience to offer real world solutions for signal
integrity, RF and harsh environment applications. We look at the overall budget for
your project and find ways to save you money on fabrication, assembly and test.
PCB Design that saves you time and money.
• Fine Pitch Bump Die
"QCG layout services are great.
They can do things other layout
houses were not able to do. I
recommend them when someone
has a difficult problem."
BGA Reball / BGA Rework
Electrical Engineering Services - Product Development
QCG provides front to back solutions for new product development. We can work with you from
inital concept, or provide a criitcal engineering support role in any phase of development:
Digital Signal Processing: DSP for Speech, Audio, Video and Communications signals.
Analog Circuit: Analog and Analog Digital circuitry
RF Design Engineering: Radio Frequency and microwave.
Engineering Research Solutions: Support on product development with critical time to market.
Embedded Software Development: FPGA and embedded processor coding implementation.
Hardware Design Solutions: Schematic development/Schematic Capture